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PE42510A
Product Specification
Thermal Data
Though the insertion loss for this part is very low,
when handling high power RF signals, the part can get
quite hot.
Figure 12. Power Dissipation
Figure 12 shows the estimated power dissipation for a
given incident RF power level. Multiple curves are
GND
RF1
1
2
24
23
GND
RF2
presented to show the effect of poor VSWR conditions.
VSWR conditions that present short circuit loads to the
part can cause significantly more power dissipation
than with proper matching.
Figure 13 shows the estimated maximum junction
temperature of the part for similar conditions.
GND
GND
GND
GND
GND
GND
3
4
5
6
7
8
E xposed
G ro u n d
P a d d le
22
21
20
19
18
17
GND
GND
GND
GND
GND
GND
Note that both of these charts assume that the case
(GND slug) temperature is held at 85°C. Special
consideration needs to be made in the design of the
PCB to properly dissipate the heat away from the part
and maintain the 85°C maximum case temperature. It
is recommended to use best design practices for high
power QFN packages: multi-layer PCBs with thermal
vias in a thermal pad soldered to the slug of the
package. Special care also needs to be made to
alleviate solder voiding under the part.
Figure 13. Maximum Junction Temperature
145
140
135 1:1 VS WR (50 Ohm Load)
130
125
2:1 VS WR (25 Ohm Load)
8:1 VS WR (6. 25 Ohm Load)
20: 1 VSWR (2.5 Ohm Load)
Table 6. Theta JC
120
115
INF:1 V SWR (0 Ohm Load)
Reliability Limit
Parameter
Theta JC (+85°C)
Min
Typ
24.0
Max
Units
C/W
110
105
100
95
90
85
30
31 3 2 33 34 35 36 37 38 39
40
41 42 43 44 45 46
RF Power (dBm)
Note: Case temperature = 85°C
Document No. 70-0266-03 │ www.psemi.com
?2008-2012 Peregrine Semiconductor Corp. All rights reserved.
Page 5 of 7
Peregrine products are protected under one or more of the following U.S. Patents: http://patents.psemi.com
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